Jy. Yun et Sw. Rhee, EFFECT OF H-2 AND N-2 IN THE REMOTE PLASMA-ENHANCED METAL-ORGANIC CHEMICAL-VAPOR-DEPOSITION OF TIN FROM TETRAKIS-DIETHYL-AMIDO-TITANIUM, Thin solid films, 312(1-2), 1998, pp. 24-26
The effect of H-2 and N-2 in the plasma in the remote plasma enhanced
metal organic chemical vapor deposition (MOCVD) of TiN from tetratkis-
diethyl-amido-titanium (TDEAT) was studied. The growth rate with H-2 i
n the plasma is about four times higher than that with N-2 in the plas
ma and both processes required similar activation energies. 9.70 and 9
.33 kcal/mol, respectively. Carbon was incorporated as TiC and hydroca
rbons in the TiN film and the fraction of carbon as TiC phase was high
er using H-2 plasma. The film deposited with H-2 in the plasma had a l
ower resistivity due to the lower level of carbon incorporation in the
film. The surface of the film deposited with N-2 in the plasma was ro
ugher. It was believed that hydrogen radicals reacted with nitrogen at
oms in TDEAT and produced Ti-rich film with lower carbon contents whil
e nitrogen radicals produced films containing much more hydrocarbon. (
C) 1998 Elsevier Science S.A.