Rd. Seager, MICROWAVE-POWER DISTRIBUTION IN A MULTICHIP-MODULE RADIATIVE INTERCONNECTION SYSTEM, Microwave and optical technology letters, 18(3), 1998, pp. 196-200
A three-dimensional model to calculate microwave power distribution in
a radiative microwave interconnection system is described. The effect
of a receiver antenna on the power available over the floor of a mult
ichip module is noted. The requirement for a low-gain, and hence relat
ively small, antenna is shown. (C) 1998 John Wiley & Sons, Inc.