PRESENT AND FUTURE-ROLE OF CHEMICAL-MECHANICAL POLISHING IN WAFER BONDING

Authors
GUI C ELWENSPOEK M GARDENIERS JGE LAMBECK PV
Citation
C. Gui et al., PRESENT AND FUTURE-ROLE OF CHEMICAL-MECHANICAL POLISHING IN WAFER BONDING, Journal of the Electrochemical Society, 145(6), 1998, pp. 2198-2204
Citations number
49
Categorie Soggetti
Electrochemistry,"Materials Science, Coatings & Films
Journal title
Journal of the Electrochemical Society → ACNP
ISSN journal
00134651
Volume
145
Issue
6
Year of publication
1998
Pages
2198 - 2204
Database
ISI
SICI code
0013-4651(1998)145:6<2198:PAFOCP>2.0.ZU;2-F
Abstract
Almost all direct wafer bonding has been conducted between chemical-me chanically polished substrates or between thin films that were present on top of the polished substrates. Introducing chemical mechanical po lishing in the wafer bonding will make a large range of materials suit able for direct wafer bonding, which has found and will find more, app lications in integrated circuits, integrated optics, sensors and actua tors, and microelectromechanical systems.