WAFER-SCALE PHOTONIC-DIE ATTACHMENT

A diebonding system has been developed for the bonding of photonic chi ps, such as lasers and photo detectors, at a rate suitable for low cos t manufacturing. This system is designed for wafer scale diebonding, m aking it compatible with wafer scale fabrication. This system combines the passive positional optical alignment of photonic chips on a silic on or glass wafer board surface with materials handling in order to ma ke the process manufacturable, The process is fluxless, minimizing con tamination of optical surfaces, and diebonding is controlled to a very small area allowing localized attachment of many die without disturbi ng previously placed die.