THE ATTACHMENT OF THIN ALUMINA CERAMIC PLATES TO KOVAR(R) USING GOLD GERMANIUM SOLDER

Authors
MATSUOKA D SMITH M ESSAID OS
Citation
D. Matsuoka et al., THE ATTACHMENT OF THIN ALUMINA CERAMIC PLATES TO KOVAR(R) USING GOLD GERMANIUM SOLDER, Engineering failure analysis, 5(1), 1998, pp. 69-75
Citations number
3
Categorie Soggetti
Engineering, Mechanical","Materials Science, Characterization & Testing
Journal title
Engineering failure analysis → ACNP
ISSN journal
13506307
Volume
5
Issue
1
Year of publication
1998
Pages
69 - 75
Database
ISI
SICI code
1350-6307(1998)5:1<69:TAOTAC>2.0.ZU;2-T
Abstract
An electronics firm experienced difficulty attaching gold metalized al umina ceramic plates to gold plated Kovar(R) alloy assemblies using go ld germanium eutectic solder. The soldering process often left large v oids in the soldered joint. Using an automated oven and various gasses to reduce the formation of oxides, a reliable and repealable process was found. Real time X-ray and cross section analysis of the joined pa rts determined that a high quality solder joint can be obtained by usi ng spring probes to fixture the assemblies. (C) 1998 Elsevier Science Ltd. All rights reserved.