G. Welzel et al., DEVELOPMENT OF SLIP LINES IN CONCENTRATED CU-BASED ALLOYS DURING WORK-HARDENING, Physica status solidi. a, Applied research, 166(2), 1998, pp. 791-804
The structure of slip lines evolving in alpha-phase Cu alloys with hig
h solute concentration during the various deformation stages was exami
ned systematically by light microscopy and electron microscopic replic
as, similar as in the early work by Mader on pure Cu. Two types of cry
stals oriented for single slip were investigated, i.e. Cu-8 at% Mn and
Cu-10.7 at% Al, differing in stacking-fault energy, but both tending
to short-range ordering. In stage I the alloys show similar patterns o
f coarse slip (slip bands, slip band bundles. Luders bands) but differ
distinctly in their fine structure of slip. The difference increases
with deformation (stage II), in Cu-Al the slip pattern varies strongly
along the crystal indicating heavy fluctuations of internal stresses,
contrary to Cu-Mn where slip evolution closely resembles that in pure
Cu. In stage III both alloys show fragmentation of the slip bands as
known from pure Cu. The microscopic reasons for these results are disc
ussed in terms of the interplay between solid solution hardening, shor
t-range ordering and stacking-fault energy.