L. Sauques et al., ALUMINUM-ALUMINUM NITRIDE CERMET FILMS - PREPARATION BY COSPUTTERING AND MICROSTRUCTURE, Surface & coatings technology, 102(1-2), 1998, pp. 25-34
Aluminium-aluminium nitride (Al-AlN) cermet films have been deposited
by RF co-sputtering. The target was an insulating aluminium nitride di
sk on which small aluminium disks were regularly displayed. The effect
of the target configuration, i.e. the influence of the number of alum
inium disks and of the sputtering time on the microstructure, has been
studied. The AI second phase content of the film can be adjusted by m
eans of the Al disk number placed on the ceramic target. The cermets a
re made of Al grains (150-200 nm) embedded in a nanocrystalline AlN ma
trix (5 nm). (C) 1998 Elsevier Science S.A.