Cl. Huang et al., The construction of production performance prediction system for semiconductor manufacturing with artificial neural networks, INT J PROD, 37(6), 1999, pp. 1387-1402
The major performance measurements for wafer fabrication system comprise WI
P level, throughput and cycle time. These measurements are influenced by va
rious factors, including machine breakdown, operator absence, poor dispatch
ing rules, emergency order and material shortage. Generally, production man
agers use the WIP level profile of each stage to identify an abnormal situa
tion, and then make corrective actions. However, such a measurement is reac
tive, not proactive. Proactive actions must effectively predict the future
performance, analyze the abnormal situation, and then generate corrective a
ctions to prevent performance from degrading. This work systematically cons
tructs artificial neural network models to predict production performances
for a semiconductor manufacturing factory. An application for a local DRAM
wafer fabrication has demonstrated the accuracy of neural network models in
predicting production performances.