Kt. Li et It. Tsai, Effect of iodide additives on the polymerization of 2,6-dimethylphenol with copper bromide n-butylamine catalyst, J CH INST C, 30(1), 1999, pp. 1-9
Citations number
18
Categorie Soggetti
Chemical Engineering
Journal title
JOURNAL OF THE CHINESE INSTITUTE OF CHEMICAL ENGINEERS
The effects of three iodide additives on the performances of two 2,6-dimeth
ylphenol polymerization catalysts based on copper bromide were studied. The
iodide additives were sodium iodide, potassium iodide and methyl iodide. T
he polymerization catalysts were CuBr2/n-butylamine and Cu2O/HBr/n-butylami
ne. Iodide addition resulted in the higher polymer molecular weight which d
ecreased in the following order: NaI > KI > CH3I. Polymerization induction
period increased significantly with NaI addition, but was insensitive to th
e concentrations of KI and CH3I. Addition of quaternary ammonium salt to th
e NaI-added catalyst dramatically shortened the induction period and greatl
y decreased the amount of copper catalyst needed. UV-VIS absorption spectro
scopy showed that the Br-->I exchange occurred with the addition of NaI int
o the copper bromide-based catalyst. Besides, I-->Cl exchange was observed
with the addition of methyltrioctylammonium chloride to the NaI-added catal
yst. The I-->Cl exchange was caused by the binding of the iodide anion to t
he quaternary ammonium cation. Copper chloride/n-butylamine complex was gen
erated after the I-->Cl exchange.