Ti50Ni50 thin foils up to 10 mu m thickness are successfully fabricated fro
m 100 mu m thickness thin plates using chemical machining. Ultrasonic agita
tion is applied to enhance the chemical etching process with mixed solution
s of HF/HNO3/H2O. The higher the HF/HNO3 volume ratio in the solution, the
higher the etching rate and the smoother the surface will be. Thin foils ca
n also be fabricated with the electropolishing process but with a much slow
er etching rate. Foil thickness by these processes can only be approximatel
y 10 mu m due to the side-etching effect. The martensitic transformation pe
aks of thin foils shown on the DSC curve are broader for a thinner sample d
ue to the effect of thermal resistance in the DSC sample pans. The enthalpy
of transformation also decreases while the foil thickness is reduced due t
o the effect of the foil surface energy and the energy of plastic deformati
on. (C) 1999 Elsevier Science S.A. All rights reserved.