Processing copper and silver matrix composites by electroless plating and hot pressing

A simple process was developed to fabricate ceramic-reinforced copper and s ilver matrix composites by electroless plating and hot pressing at 873 K an d 300 MPa, in air. Composites were produced containing 10 to 30 vol pet cer amic reinforcements of different sizes and shapes including silicon carbide whiskers (SiCw), alumina particles (Al2O3p), carbon short fibers (Carbon(s f)), and Saffil short fibers (Saffil(sf)) (3.8 pet SiO2-96.2 pet Al2O3) uni formly distributed within the matrix. The hardness and bending strength of the composites were much higher than those of the pure matrices. The electr ical conductivity, measured by a four-point probe method, was similar to th at of traditional CdO/ Ag electrical contact materials. The surface morphol ogies and cross-sectional microstructures of the are-eroded Al2O3p/Ag compo sites were similar to those of conventional CdO/Ag and SnO2/Ag and exhibite d a good are-erosion resistance. These composites combine the high strength and elevated-temperature stability of the ceramic reinforcements with the good electrical and thermal conductivity of the two metallic matrices.