We used an in situ ellipsometer to measure the temperature-dependent growth
curves, which are Delta versus psi curves measured in real time, of the Au
thin-films deposited under identical conditions, with the exception of dir
substrate temperature, for 240 s on thermally oxidized Si wafers by magnet
ron sputtering. The growth curves measured at substrate temperatures of 50,
100, 150, and 200 degrees C, respectively, exhibited distinctive temperatu
re-dependent trajectories; as we raised the substrate temperature, the radi
us of curvature increased. We were able to analyze the temperature dependen
t variation of ellipsometric constants by introducing a growth model such t
hat the void fraction decreased as a function of thickness, and also using
the results of spectroscopic ellipsometry analysis. We found that the remna
nt void fraction, the void fraction decrease rate, and the depolarization f
actor are the major parameters that govern the observed temperature depende
nce of growth curves. (C) 1999 Elsevier Science S.A. All rights reserved.