Jh. Oh et al., Effects of the different heat treatments on the growth and formation of iron silicide on Si(100), THIN SOL FI, 341(1-2), 1999, pp. 160-164
We have investigated the formation and growth of iron silicides by the soli
d phase epitaxy (SPE) and reactive deposition epitaxy (RDE) + post-annealin
g. Semiconducting beta-FeSi2 was grown on a Si(100) substrate using an elec
tron beam deposition system. In the case of the SPE, although an epitaxial
beta-FeSi2 was grown to about 200 Angstrom, the mixed layer of beta-FeSi2 a
nd other phases existed on the epitaxial layer. On the other hands, in the
ease of the RDE + post-annealing, the thick beta-FeSi2 film was grown with
the thickness of about 3100 Angstrom by post-annealing at 700 degrees C aft
er deposition at 200 degrees C. In the beta-FeSi2 film, the epitaxial beta-
FeSi2 grain was grown with a size of about 2500 Angstrom and the epitaxial
tendency was B-type. From these results, it seems that the RDE + post-annea
ling method is more preferable than the SPE fur the growth of a thick epita
xial beta-FeSi2 film. (C) 1999 Elsevier Science S.A. All rights reserved.