TRANSIENT LIQUID-PHASE DIFFUSION BONDING OF 8090-AL-LI ALLOY USING COPPER INTERLAYER

Authors
DUNFORD DV PARTRIDGE PG
Citation
Dv. Dunford et Pg. Partridge, TRANSIENT LIQUID-PHASE DIFFUSION BONDING OF 8090-AL-LI ALLOY USING COPPER INTERLAYER, Materials science and technology, 14(5), 1998, pp. 422-428
Citations number
18
Categorie Soggetti
Metallurgy & Metallurigical Engineering","Material Science
Journal title
Materials science and technology → ACNP
ISSN journal
02670836
Volume
14
Issue
5
Year of publication
1998
Pages
422 - 428
Database
ISI
SICI code
0267-0836(1998)14:5<422:TLDBO8>2.0.ZU;2-Y
Abstract
Transient liquid phase (TLP) diffusion bonded (DB) joints hare been pr oduced in 8090 aluminium alloy (of nominal composition (wt-%) Al-25Li- 1.3Cu-08Mg-0.12Zr-0.1Fe-0105Si) using copper interlayers. Transient li quid phase formation and melt solidification were controlled by solid state diffusion of copper along Al-Li alloy grain boundaries. The shea r strengths of the TLP DB joints were comparable with the shear streng ths of solid state DB joints and greater than 90% of that of the base metal. (C) Crown Copyright DERA, 1998.