The elektrolytic metal migration is a failure mechanism in electronic
and electrotechnical components, devices, and equipments. The paper pr
esents a review of silver migration phenomena especially, The conditio
ns and anodic oxidation are also treated. Silver migrations lead to de
scribe formation and eventually cause failure stages. Possibilities an
d evaluation of faults are discussed. Inhibition or prevention of silv
er migration are reviewed in light of the environmental conditions, co
nductor composition, and dielectric substrates.