A. Rahman et al., THE USE OF RELIABILITY FACTORS IN ANALYZING POWDER PATTERNS IN PT-SI SPUTTERING TARGETS AND SUBSEQUENT FILMS, Journal of materials research, 13(6), 1998, pp. 1517-1521
X-ray powder diffraction was used to characterize a Pt-Si sputtering t
arget and subsequent films. The powder patterns of each sample indicat
ed lines due to diffraction from different phases. We have initiated a
preliminary study through which we have analyzed and characterized th
ese films. The results presented for these samples corroborate with re
sults observed for this system in the planar configuration.