Boron nitride thin films were deposited by tuned substrate rf magnetro
n sputtering from an h-BN target. Pure Ar, 85% Ar+15% N-2 and Ar+10%<H
-2<30% were used as processing gases. A threshold value of momentum pe
r deposited atom was found, around 600 eV(1/2) amu(1/2), to obtain fil
ms with a high content of the cubic phase (between 70 and 90%). By int
roducing H-2 into the gas mixture, an attempt was made to improve stab
ility of the films exposed to the air atmosphere, which was achieved a
t 18% H-2 content. However, a decrease in cBN percentage, deduced from
IR spectra, was observed. A 50% Ar+50% N-2 gas mixture was also used
for ''in situ'' deposition of hBN coatings on cBN films. The resulting
films exhibited longer lifetimes and different methods of delaminatio
n, observed by SEM, than films without hBN coatings. Besides these att
empts, different substrates were tested. B-doped (100)-Si showed great
er stability than P-doped (100)-Si, and a buffer layer of 40 Angstrom
Ni improved the adherence of 18% H-2 film. However, neither buffer lay
ers consisting of diamond nor other Ni thickness, nor mechanical scrat
ching of silicon with diamond and cBN powders, were successful. From X
PS analysis, the B/N atomic ratio was estimated to be in the range of
1.05-1.10 for films obtained with 85% Ar+15% N-2 and 1.15-1.20 for fil
ms deposited in pure Ar and in an Ar+H-2 atmosphere. (C) 1998 Elsevier
Science S.A.