Jd. Segal et al., A VERTICAL HIGH-VOLTAGE TERMINATION STRUCTURE FOR HIGH-RESISTIVITY SILICON DETECTORS, IEEE transactions on nuclear science, 45(3), 1998, pp. 364-369
A new high voltage diode termination structure has been developed far
the backside junction of silicon detectors which require double-sided
processing. The new structure consists of a deep vertical etch through
the diode at the edge of the detector. It requires only one mask, and
is extremely robust to scratches or other mechanical damage. The vert
ical termination has been successfully applied to an integrated pixel
detector, where it increased yield. It has also been applied to an 8mm
diameter cylindrical drift detector.