REAL-TIME MONITORING AND SIMULATION OF THERMAL DEFORMATION IN PLASTICPACKAGE

Thermally-induced failure is a major reliability issue for electronic packaging. Due to the highly nonlinear behaviors and thermal mismatch of packaging materials, an electronic package exhibits uneven thermal deformation in the whole temperature range during thermal cycling. Thi s behavior will affect the buildup of thermal strain/stress within the package, which may affect the reliability of the package. Therefore, a real-lime method is needed to monitor the thermal deformation of pac kages during the thermal cycling. h this study, a real-time moire inte rferometry technique coupled with a thermal vacuum chamber is used to monitor the thermal deformation of a plastic package. A grating is tra nsferred onto the cross section of the sample at room temperature. The fringe patterns ar e recorded by a CCD camera system and are compared with the displacement contours obtained by nonlinear finite element s imulation. High temperature moire results up to 200 degrees C are repo rted here. The comparison between the moire fringe patterns and finite element results shows a good agreement. The results also show that th e real-time moire interferometry technique is an effective way to moni tor the thermal deformation of electronic packaging and is a powerful validation method for finite element analysis.