A. Cziraki et al., A CROSS-SECTIONAL HIGH-RESOLUTION TRANSMISSION ELECTRON-MICROSCOPY STUDY OF ELECTRODEPOSITED NI-CU CU MULTILAYERS/, Thin solid films, 318(1-2), 1998, pp. 239-242
This work is an extension of our previous structural study performed b
y conventional transmission electron microscopy (TEM) on electrodeposi
ted Ni-Cu/Cu multilayers exhibiting giant magnetoresistance (GMR). It
could be established from the present atomic-resolution structural stu
dies that (i) the layered structure found by conventional TEM to be fl
at and smooth shows an interface roughness spread over a few atomic mo
nolayers; (ii) the atomic planes cross, in most cases, continuously th
e Ni-Cu/Cu interface, i,e., forming a coherent superlattice; (iii) the
atomic planes exhibit a periodic distortion due to the unrelaxed stra
in induced by the lattice mismatch between the magnetic and non-magnet
ic constituent layers. (C) 1998 Elsevier Science S.A.