Fringing-induced barrier lowering (FIBL), a new anomalous degradation
in device turn-off/on characteristics in sub-100nm devices with high-K
gate dielectrics, is reported. FIBL is clearly evident fcr K > 25 and
worsens as K increases (without buffer oxide). With a buffer oxide, F
IBL can lx completely suppressed for K < 25, and partially for higher
ii. FIBL worsens as the gate length becomes shorter. Complete removal
of high-K dielectrics on the active area induces a smaller FIBL.