RBS AS A TOOL FOR TOPOGRAPHIC MODELING OF POLYCRYSTALLINE THIN-FILM INTERACTIONS

Thermal interdiffusion between polycrystalline metal films may involve a variety of concurrent processes, such as grain boundary or pipe pen etration, solution of one metal in the other, grain growth and aggrega tion, and interface roughening. A detailed analysis of a series of RES profile shapes obtained as such interactions proceed can provide info rmation about the individual constituent processes and their kinetics. Examples are shown for the interactions of Ta-NiFe, Ta-Ni, Ta-Fe, Au- Ni and Ag-NiFe, in which extended time-temperature annealing matrices have allowed us to obtain new information, in particular on the role o f grain boundary diffusion at relatively low temperatures, and the mic roscopic thermal stability of these interfaces. (C) 1998 Elsevier Scie nce B.V.