DEVELOPMENT OF REACTIVE PROCESSING TECHNO LOGY FOR POLYOXYPHENYLENE-POLYAMIDE ALLOY

High performance polyoxyphenylene-polyamide alloy was developed by rea ctive processinng technology. Addition of very small amount of reactiv e compatibilizer during molten mixing process partially gives a block copolymer composed of polyoxyphenylene and polyamide which plays an im portant role in the fine dispersion of the polyoxyphenylene in the pol yamide matrix. Reactive compatibilizer has carbon-carbon unsaturated b ond and acid group, such as maleic anhydride. The block copolymer was quantified by Soxhlet's successive extraction. The structure of the bl ock copolymer was confirmed by IR and DSC. Transmission electron micro scopic observation showed that the block copolymer existed interface b etween polyoxyphenylene and polyamide. To improve the impact strength and heat resistance of materials, we have found that the formation of the ''sea-island-lake'' (polyoxyphenylene-polyamide-elastomer) structu re is desirable.