FURTHER EXAMINATIONS OF CARBON POLYESTERIMIDE THICK-FILM RESISTORS

Authors
DZIEDZIC A CZARCZYNSKA H LICZNERSKI BW RANGELOV I
Citation
A. Dziedzic et al., FURTHER EXAMINATIONS OF CARBON POLYESTERIMIDE THICK-FILM RESISTORS, Journal of materials science. Materials in electronics, 4(3), 1993, pp. 233-240
Citations number
15
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Condensed Matter","Material Science
Journal title
Journal of materials science. Materials in electronics → ACNP
ISSN journal
09574522
Volume
4
Issue
3
Year of publication
1993
Pages
233 - 240
Database
ISI
SICI code
0957-4522(1993)4:3<233:FEOCPT>2.0.ZU;2-D
Abstract
A carbon (carbon black and/or graphite)/polyesterimide resin system ha s been used as a material for polymer thick-film resistors. The physic al and chemical properties of this system as a function of curing temp erature were evaluated by means of resistance measurements during the curing process, thermogravimetric analysis, adhesion measurements and scanning electron microscopy examinations. The temperature range betwe en 250 and 300-degrees-C has been chosen as the most suitable. The bas ic electrical properties and the resistance stability to low and high temperature shocks and humidity exposure have been evaluated in relati on to the conductive filler used in the ink.