IRREGULAR SURFACE AND POROUS STRUCTURE OF SIO2-FILMS DEPOSITED AT LOW-TEMPERATURE AND LOW-PRESSURE

Citation
Fn. Dultsev et al., IRREGULAR SURFACE AND POROUS STRUCTURE OF SIO2-FILMS DEPOSITED AT LOW-TEMPERATURE AND LOW-PRESSURE, Journal of the Electrochemical Society, 145(7), 1998, pp. 2569-2572
Citations number
17
Categorie Soggetti
Electrochemistry,"Materials Science, Coatings & Films
ISSN journal
00134651
Volume
145
Issue
7
Year of publication
1998
Pages
2569 - 2572
Database
ISI
SICI code
0013-4651(1998)145:7<2569:ISAPSO>2.0.ZU;2-W
Abstract
The porous structure of silicon dioxide layers obtained by chemical va por deposition during monosilane oxidation by oxygen in the pressure r ange of 0.5-1.2 Torr at 150 degrees C has been studied by means of ads orption porometry. Mesopore size distribution has been found to be sha rply dependent on the pressure of the gas mixture at which the deposit ion is carried out. The specific surface area of the layers obtained a t different pressures has also been measured by means of the adsorptio n method. It has been stated that over the scale range of about 18-45 Angstrom(2) the surfaces of the layers obtained at 0.5 and 0.8 Torr ar e fractal. The fractal dimensions of the surface (D) have been determi ned to be 2.92 +/- 0.10 and 2.78 +/- 0.12, respectively, for the two g iven pressure values.