Fn. Dultsev et al., IRREGULAR SURFACE AND POROUS STRUCTURE OF SIO2-FILMS DEPOSITED AT LOW-TEMPERATURE AND LOW-PRESSURE, Journal of the Electrochemical Society, 145(7), 1998, pp. 2569-2572
Citations number
17
Categorie Soggetti
Electrochemistry,"Materials Science, Coatings & Films
The porous structure of silicon dioxide layers obtained by chemical va
por deposition during monosilane oxidation by oxygen in the pressure r
ange of 0.5-1.2 Torr at 150 degrees C has been studied by means of ads
orption porometry. Mesopore size distribution has been found to be sha
rply dependent on the pressure of the gas mixture at which the deposit
ion is carried out. The specific surface area of the layers obtained a
t different pressures has also been measured by means of the adsorptio
n method. It has been stated that over the scale range of about 18-45
Angstrom(2) the surfaces of the layers obtained at 0.5 and 0.8 Torr ar
e fractal. The fractal dimensions of the surface (D) have been determi
ned to be 2.92 +/- 0.10 and 2.78 +/- 0.12, respectively, for the two g
iven pressure values.