Dj. Miller et al., MICROSTRUCTURE AND TRANSPORT BEHAVIOR OF GRAIN-BOUNDARIES IN YBA2CU3OY - A COMPARISON BETWEEN THIN-FILMS AND BULK BICRYSTALS, Materials science & engineering. B, Solid-state materials for advanced technology, 53(1-2), 1998, pp. 125-131
The microstructure and transport properties of grain boundaries in thi
n film and bulk bicrystals of YBa2Cu3O7-delta have been studied in det
ail. In this paper, we will concentrate on the unique features of grai
n boundaries in dual-seeded bulk bicrystals, particularly in compariso
n with grain boundaries in thin film bicrystals. The structures of the
se two types of grain boundaries can be very different: thin film boun
daries typically exhibit meandering and impurity phases that extend th
rough the thickness of the film while the bulk boundaries exhibit long
, straight facets that can be relatively free of impurity phases. Whil
e the meandering configurations of grain boundaries in thin films has
led to inconsistencies in transport results, the planar grain boundari
es found in bulk samples provide an excellent opportunity to study the
grain boundary transport behavior in a simpler geometry. Furthermore,
the fabrication of these bulk bicrystals is flexible and reproducible
so that boundaries of virtually any misorientation may be prepared. A
s an example of this versatility, we have systematically measured the
transport critical current density as a function of misorientation ang
le in bulk bicrystals and compare these results with those measured in
thin film bicrystals. (C) 1998 Published by Elsevier Science S.A. All
rights reserved.