IN-SITU STRESS-ANALYSIS OF BORON-NITRIDE FILMS PREPARED BY ION-BEAM-ASSISTED DEPOSITION

Citation
M. Zeitler et al., IN-SITU STRESS-ANALYSIS OF BORON-NITRIDE FILMS PREPARED BY ION-BEAM-ASSISTED DEPOSITION, Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms, 139(1-4), 1998, pp. 327-331
Citations number
20
Categorie Soggetti
Instument & Instrumentation","Nuclear Sciences & Tecnology","Physics, Atomic, Molecular & Chemical","Physics, Nuclear
ISSN journal
0168583X
Volume
139
Issue
1-4
Year of publication
1998
Pages
327 - 331
Database
ISI
SICI code
0168-583X(1998)139:1-4<327:ISOBFP>2.0.ZU;2-K
Abstract
Boron nitride films have been deposited on Si (0 0 1) substrates by N/ Ar ion beam assisted deposition (IBAD) and the evolution of the intrin sic stress has been in situ measured by a very sensitive capacitiv tec hnique. After about ten monolayers the growing boron nitride film seem s to be closed and the tensile stress at the beginning of the experime nt turns to compressive stress. With increasing energy of the nitrogen and argon ions and the temperature of the substrate during deposition the final stress and the content of c-BN are increased. In situ measu rements of the evolution of the intrinsic stress show a strong differe nce between mainly h-BN and mainly c-BN films due to the implantation induced defect concentration and the plastic deformation in the film. (C) 1998 Elsevier Science B.V.