PICK-AND-PLACE MULTIWAFER BONDING FOR OPTOELECTRONIC INTEGRATION

Authors
ZHU ZH ZHOU YC CROUSE D LO YH
Citation
Zh. Zhu et al., PICK-AND-PLACE MULTIWAFER BONDING FOR OPTOELECTRONIC INTEGRATION, Electronics Letters, 34(12), 1998, pp. 1256-1257
Citations number
6
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Electronics Letters → ACNP
ISSN journal
00135194
Volume
34
Issue
12
Year of publication
1998
Pages
1256 - 1257
Database
ISI
SICI code
0013-5194(1998)34:12<1256:PMBFOI>2.0.ZU;2-7
Abstract
The pick-and-place multi-wafer bonding technology is demonstrated by s imultaneous direct bonding of nine I.3 mu m InP strain-compensated mul tiquantum welt wafers to a GaAs substrate. Both thr bonded sample and the control sample showed identical X-ray diffraction characteristics and the bonded wafers had similar to 75% room temperature photolumines cence intensities relative to the control sample.