The paper explores the use of open-celled metal foams as compact hear
exchangers, exploiting convective cooling. An analytical model is deve
loped for model foams with simple cubic unit cells consisting of heate
d slender cylinders, based on existing heat transfer data on convectiv
e crossflow through cylinder banks. A foam-filled channel having const
ant wall temperatures is analyzed to obtain the temperature distributi
on inside the channel as a function of foam density, cell size and oth
er pertinent heat transfer parameters. Two characteristic length scale
s of importance to the problem are discussed: the minimum channel leng
th required for heating the fluid to its goal temperature and the ther
mal entry length beyond which the transfer of heat between fluid and c
hannel wall assumes a constant coefficient, The overall heat transfer
coefficient of the heat exchanging system is calculated, and the press
ure drop experienced by the fluid flow obtained. These results are use
d to analyze and guide the design of optimum foam structures that woul
d maximize heat transfer per unit pumping power. Two examples are give
n to demonstrate the applicability of the analytical model: heat sinks
for high power electronic devices and multi-layered heat exchangers f
or aeronautical applications. The present model perhaps oversimplifies
the calculation of transport in a metal foam consisting of non-circul
ar, possibly sharp-edged ligaments, and so likely leads to overestimat
es. Nevertheless the trends of heat transfer predicted by the model (f
or dependence on foam relative density, duct geometries, fluid velocit
y, etc.) are expected to be valid for a wide range of open-cell foams
and are in reasonable agreement with available experimental data on al
uminum foams (Bastawros and Evans, Proc. Symp. Application of Heat Tra
nsfer in Microelectronics Packaging. [MECE, Dallas, TX, 1997). (C) 199
8 Acta Metallurgica Inc.