EVALUATION OF INTERFACIAL BOND STRENGTHS BETWEEN AMALGAM AND COMPOSITE INLAY

Purpose: To evaluate the interfacial bond strengths between two amalga m alloys and an inlay resin composite bonded with two different luting agents. Materials and Methods: Inlay composites (EOS) were bonded wit h two different bonding systems (Geristore, All-Bond 2) to high- or lo w-copper amalgams (Valiant, Agestan). All tested specimens were thermo cycled (100 cycles), tested for tensile bond strength and compared by ANOVA (P < 0.05). Results: Bond strengths varied from 5.3 to 11.4 MPa, with Geristore bonded to high-copper amalgam providing the highest st rength.