Ah. Abdelaziz et Ha. Alhadainy, EVALUATION OF INTERFACIAL BOND STRENGTHS BETWEEN AMALGAM AND COMPOSITE INLAY, American journal of dentistry, 11(3), 1998, pp. 131-133
Purpose: To evaluate the interfacial bond strengths between two amalga
m alloys and an inlay resin composite bonded with two different luting
agents. Materials and Methods: Inlay composites (EOS) were bonded wit
h two different bonding systems (Geristore, All-Bond 2) to high- or lo
w-copper amalgams (Valiant, Agestan). All tested specimens were thermo
cycled (100 cycles), tested for tensile bond strength and compared by
ANOVA (P < 0.05). Results: Bond strengths varied from 5.3 to 11.4 MPa,
with Geristore bonded to high-copper amalgam providing the highest st
rength.