THERMOMECHANICAL STUDIES ON NEWLY DEVELOPED COPOLYESTER THIN-FILMS - PART II - THERMAL AND INTRINSIC STRESS

Thermal stresses were determined by a wafer bending technique for a ne wly developed family of all-aromatic and aromatic/aliphatic copolyeste r thermosetting films prepared by spin coating. The intrinsic stresses of the films were also estimated for T > T-g (glass transition temper ature). The effects of chemical structure and film processing conditio ns on thermal stresses are discussed. Thermal stresses varied with tem perature and processing conditions, and the variations were dependent upon the chemical structures and T-g of the copolyester films. The T-g 's of different copolyesters were also estimated from thermal stress-t emperature curves.