A new in situ vacuum surface-cleaning process uses microcluster beams
formed by electrohydrodynamic emission from capillaries to clean surfa
ces contaminated by solid particulates and organic films. Proposed sur
face-cleaning mechanisms include a model based on transfer of impulsiv
e forces during collisions between microclusters and solid particles.
Microschocks induced in thin contaminant films during microcluster imp
act are also discussed.