M. Utriainen et al., STUDIES OF NIO THIN-FILM FORMATION BY ATOMIC LAYER EPITAXY, Materials science & engineering. B, Solid-state materials for advanced technology, 54(1-2), 1998, pp. 98-103
Nickel oxide thin film formation by atomic layer epitaxy (ALE) was stu
died including aspects of surface chemistry and structure of the prepa
red films. The applied source materials were Ni(acac)(2), Ni(apo)(2),
Ni(dmg)(2) and O-2, H2O, N2O, O-3, CH3COOH for Ni and O, respectively.
The thermal behaviour of the Ni-containing precursors was studied by
thermogravimetry and by experiments in the ALE reactor. The reactivity
of the Ni-precursors towards various oxygen sources was studied at th
e deposition temperature of 250 degrees C using soda-lime glass substr
ates. The crystalline rocksalt-type NiO was obtained only when O-3 was
used as an oxygen source. The him was in this case (100) oriented NiO
independent on the applied Ni-precursor. The NiO ALE process was opti
mized for the reaction between Ni(acac)(2) and O-3. The surface-satura
ted growth rate was limited by the steric hindrance of the ligand and
was 0.62 Angstrom cycle(-1). A slightly increased growth rate (0.72 An
gstrom cycle(-1)) was observed, when H2O was supplied together with O-
3 as an oxygen source. Structure of the deposited films was studied by
atomic force microscopy and X-ray diffraction techniques and some str
uctural variations related to high ozone doses were observed. (C) 1998
Elsevier Science S.A. All rights reserved.