A FAST ALGORITHM FOR DETECTING DIE EXTRUSION DEFECTS IN IC PACKAGES

Authors
ZHOU H KASSIM AA RANGANATH S
Citation
H. Zhou et al., A FAST ALGORITHM FOR DETECTING DIE EXTRUSION DEFECTS IN IC PACKAGES, Machine vision and applications, 11(1), 1998, pp. 37-41
Citations number
12
Categorie Soggetti
Computer Science Cybernetics","Computer Science Artificial Intelligence","Engineering, Eletrical & Electronic","Computer Science Artificial Intelligence","Computer Science Cybernetics
Journal title
Machine vision and applications → ACNP
ISSN journal
09328092
Volume
11
Issue
1
Year of publication
1998
Pages
37 - 41
Database
ISI
SICI code
0932-8092(1998)11:1<37:AFAFDD>2.0.ZU;2-A
Abstract
In this paper, we present a fast method for the detection of die extru sion defects in IC packages. The optical and lighting set-up as well a s the details of the algorithm used for the isolation and detection of die extrusion defects are presented. Our algorithm basically involves the use of optimal filters for the detection of linear features and o ther feature enhancement techniques. This paper also addresses impleme ntation issues including speed, effectiveness, and robustness.