Fl. Shan et al., MICROHARDNESS EVALUATION OF CU-NI MULTILAYERED FILMS BY X-RAY-DIFFRACTION LINE-PROFILE ANALYSIS, Thin solid films, 324(1-2), 1998, pp. 162-164
Copper-nickel multilayered films were sputtered on silicon and stainle
ss steel substrates, respectively. The dislocation density and the dis
location distribution parameter in multilayered films were deduced wit
h X-ray diffraction line profile analysis method. Microhardness was ca
lculated from the dislocation data. The results show that the microhar
dness values are in a good agreement between calculated values and mea
sured values. (C) 1998 Elsevier Science S.A. All rights reserved.