MICROHARDNESS EVALUATION OF CU-NI MULTILAYERED FILMS BY X-RAY-DIFFRACTION LINE-PROFILE ANALYSIS

Authors
SHAN FL GAO ZM WANG YM
Citation
Fl. Shan et al., MICROHARDNESS EVALUATION OF CU-NI MULTILAYERED FILMS BY X-RAY-DIFFRACTION LINE-PROFILE ANALYSIS, Thin solid films, 324(1-2), 1998, pp. 162-164
Citations number
10
Categorie Soggetti
Physics, Applied","Material Science","Physics, Condensed Matter
Journal title
Thin solid films → ACNP
ISSN journal
00406090
Volume
324
Issue
1-2
Year of publication
1998
Pages
162 - 164
Database
ISI
SICI code
0040-6090(1998)324:1-2<162:MEOCMF>2.0.ZU;2-R
Abstract
Copper-nickel multilayered films were sputtered on silicon and stainle ss steel substrates, respectively. The dislocation density and the dis location distribution parameter in multilayered films were deduced wit h X-ray diffraction line profile analysis method. Microhardness was ca lculated from the dislocation data. The results show that the microhar dness values are in a good agreement between calculated values and mea sured values. (C) 1998 Elsevier Science S.A. All rights reserved.