DIRECT METALLIZATION USING SULFONATION OF THERMOSETTING POLYPHENYLENEETHER RESIN LAMINATE

A new, direct metallization method of a thermosetting allylated poly-2 ,6-dimethyl-1,4-phenylene ether (A-PPE) resin for manufacture of print ed wiring boards is proposed, The A-PPE resin surface was roughened by the potassium permanganate/sodium hydroxide mixed solution treatment. The sulfo group, as a cation exchange group, was introduced onto the A-PPE resin surface via sulfuric acid treatment. The amount of adsorbe d copper ions increased with increasing sulfuric acid concentration, a nd was 1000 nmol/cm(2) for the sample treated with 18 M sulfuric acid at 70 degrees C for five min, The thickness of the thin copper film fo rmed after the reduction process was estimated to be 71 nm, The test s amples permit direct electroplating of copper at a current density of 2 A/dm(2).