INFLUENCE OF STRESS IN THIN-FILM MODULUS MEASUREMENTS BY THE VIBRATING REED TECHNIQUE

Citation
U. Harms et al., INFLUENCE OF STRESS IN THIN-FILM MODULUS MEASUREMENTS BY THE VIBRATING REED TECHNIQUE, Thin solid films, 323(1-2), 1998, pp. 153-157
Citations number
11
Categorie Soggetti
Physics, Applied","Material Science","Physics, Condensed Matter
Journal title
ISSN journal
00406090
Volume
323
Issue
1-2
Year of publication
1998
Pages
153 - 157
Database
ISI
SICI code
0040-6090(1998)323:1-2<153:IOSITM>2.0.ZU;2-S
Abstract
One method to measure thin film elastic properties is use of the vibra ting reed technique to compare stiffness of uncoated and coated cantil ever beams. Since the change of frequency is used to calculate the mod ulus, the change of frequency caused by curvature due to film stress h as to be investigated. We present simultaneous measurement of resonant frequencies and curvature to show that curvature can cause large effe cts, depending on the geometry. An approximate calculation indicates i n which cases stress may be neglected. A method to determine stress fr om combination of torsional and flexural vibrating frequency measureme nts is proposed. (C) 1998 Elsevier Science S.A. All rights reserved.