This paper presents a review of the evolution of the cryo-electronics
since the 50's up to date. With this review we make a prediction of ap
plicability for RF-electronics, nanoelectronics, and giga-scaled elect
ronics, in a perspective for the years 2000 to come. This study is bas
ed on a survey of scientific papers/reports published since the years
1950's up to date in the field of semiconductor materials, devices and
electronic systems for cryo-applications. With the very recent advent
of nanotechnologies, multiple-level-wiring interconnections, hybrid s
uperconductor-semiconductor systems, the rapid evolution of mini- and
micro-coolers, and the appearance of physical limitations for further
downscaling, it is worth to explore the option of cryo-operation of el
ectronic devices/systems, and identify possible limitations, possible
applications, and establish future guidelines.