Je. Leland et Lc. Chow, IMMERSION COOLING OF A SIMULATED ELECTRONIC CHIP PROTRUDING INTO A FLOW CHANNEL, Journal of thermophysics and heat transfer, 12(3), 1998, pp. 398-405
Nucleate boiling and critical heat flux from the top and side surfaces
of a simulated electronic chip protruding into a rectangular channel
has been studied. To ascertain the contributions of heat transfer from
the sides and top of the simulated electronic chip, boiling from the
sides was virtually eliminated by the use of a thin (0.025 mm) foil he
ater on top of a block of insulating material. It was found that singl
e-phase heat transfer and critical heat flux are markedly greater for
a surface protrusion height of 0.71 mm as compared to a hush surface.
This increase was seen for flow velocities greater than 1 m/s and a su
bcooling of 20 degrees C. The results are compared to that for a coppe
r block heated from below under similar fluid and geometry constraints
. These comparisons show that the vapor emanating from the upstream si
de of the copper block plays an important role in either decreasing or
increasing the critical heat flux. Additional results were obtained f
or the copper block where heal transfer from the upstream side was obs
tructed. These results indicate that under some conditions of subcooli
ng and flow rate an optimal amount of upstream side vapor production e
xists.