Mk. Lee et al., THE IMPROVEMENT OF LIQUID-PHASE DEPOSITION OF SILICON DIOXIDE WITH HYDROCHLORIC-ACID INCORPORATION, JPN J A P 2, 37(6A), 1998, pp. 682-683
Liquid phase deposition of silicon dioxide (LPD-SiO2) provides the adv
antages of room temperature growth, good step coverage and selective g
rowth, and has high potential in integrated circuit fabrications. In t
his paper, a simple method to improve the quality of LPD-SiO2 was deve
loped with the incorporation of hydrochloric acid (HCl) which can enha
nce the deposition rate of LPD-SiO2. From the current-voltage and capa
citance-voltage characteristics, the hat-hand voltage and leakage curr
ent were improved by HCl incorporation into LPD-SiO2 films.