TiN thin films were grown by atomic layer epitaxy using titanium tetra
iodide (TiI4) and ammonia (NH3) as precursors. The films were characte
rized with Rutherford backscattering spectrometry, time-of-flight elas
tic recoil detection analysis, energy dispersive X-ray spectroscopy, X
-ray diffraction: scanning electron microscopy, and resistivity measur
ements. Both the growth rate and Trim quality were markedly dependent
on the growth temperature. As the temperature was increased from 400 t
o 500 degrees C the growth rate increased from 0.12 to 0.30 Angstrom/c
ycle, and the resistivity decreased from 380 to 70 mu Ohm cm. Also, th
e oxygen content decreased with increasing temperature being about 10
atom % in the films grown at 475 to 500 degrees C. The iodine contents
were below 0.5 atom %.