N. Hayafuji et al., RELIABILITY IMPROVEMENT OF ALINAS GAINAS HIGH-ELECTRON-MOBILITY TRANSISTORS BY FLUORINE INCORPORATION CONTROL/, Journal of the Electrochemical Society, 145(8), 1998, pp. 2951-2954
Citations number
12
Categorie Soggetti
Electrochemistry,"Materials Science, Coatings & Films
The effectiveness of fluorine incorporation control for reliability im
provement of the AlInAs/GaInAs high electron mobility transistor (HEMT
) is demonstrated. The inverted-type HEMT ( HEMT) is found to be one o
f the feasible structures. In this structure, the GaInAs channel layer
functions as a blocking layer against the thermal diffusion of fluori
ne into the AlInAs electron supply layer, which is a main cause of the
electrical deterioration in the HEMT material. Under de operation at
an ambient temperature of 170 degrees C, the zero-gate-bias saturated
drain current of the i-HEMT decreases only a few percent even after 3,
500 h. The projected median-time-to-failure of the i-HEMT is estimated
to be 10(7) h at a temperature of 125 degrees C, which is almost twic
e that of the conventional-type AlInAs/GaInAs HEMT.