The effects of solvents on the curing behaviors of an epoxy (diglycidy
l ether of bisphenol-a) and dicyandiamide/2-methyl imidazole system ha
ve been studied with differential thermal calorimetry (DSC) and Fourie
r transform infrared spectroscopy (FTIR). From DSC analyses of the spe
cimens prepared with unsealed aluminum pans, the reaction exotherm, th
e time to maximal curing rate, the glass-transition temperature, the r
ate constant, and the reaction order of the epoxy system decrease in t
he presence of solvents were obtained. The changes were in the order o
f toluene>tetra-hydrofuran>acetone and which are consistent with the o
rder of their boiling points. The heat absorbed during the solvent eva
poration consumed the curing exotherm and resulted in a change in temp
erature dependent curing mechanisms. The results from FTIR spectra con
firmed that the composition of the cured resin was influenced by the c
uring temperature and the type of the solvent used. (C) 1998 Elsevier
Science B.V.