A SIMPLE OHMIC-CONTACT FORMATION TECHNOLOGY USING PHOSPHINE PLASMA TREATMENT FOR TOP-GATE AMORPHOUS-SILICON THIN-FILM TRANSISTORS
Citation
E. Ugai et al., A SIMPLE OHMIC-CONTACT FORMATION TECHNOLOGY USING PHOSPHINE PLASMA TREATMENT FOR TOP-GATE AMORPHOUS-SILICON THIN-FILM TRANSISTORS, JPN J A P 1, 37(6A), 1998, pp. 3226-3231
Categorie Soggetti
Physics, Applied
Abstract
The effects of exposing patterned indium-tin-oxide (ITO) on amorphous
silicon oxide (a-SiOx) to a phosphine (PH3) plasma has been investigat
ed. Phosphorous atoms react with ITO to form InPOx and InP, with a muc
h smaller number being deposited on a-SiOx. If amorphous silicon (a-Si
) is then deposited onto these layers by plasma enhanced chemical vapo
r deposition, phosphorous atoms from the ITO are incorporated into the
a-Si in the region of the ITO. This effectively dopes the a-Si to for
m good ohmic contacts between the ITO and a-Si layers. In contrast, th
e number of phosphorus atoms incorporated into a-Si directly above a-S
iOx is too small to have an effect on the electrical properties of a-S
i. The doping mechanism for the ITO and a-Si is discussed, and an expl
anation given as to how these features can be used to mass produce hig
h performance top-gale a-Si thin film transistors using only three pho
tomask steps.