THERMAL DESIGN ENSURES RF POWER-AMP RELIABILITY

Citation
M. Loy et al., THERMAL DESIGN ENSURES RF POWER-AMP RELIABILITY, Microwaves & RF, 37(7), 1998, pp. 55
Citations number
9
Categorie Soggetti
Engineering, Eletrical & Electronic",Telecommunications
Journal title
ISSN journal
07452993
Volume
37
Issue
7
Year of publication
1998
Database
ISI
SICI code
0745-2993(1998)37:7<55:TDERPR>2.0.ZU;2-I