3-DIMENSIONAL MEMORY MODULE ASSEMBLY TECHNOLOGY

To meet the demand for higher density and greater capacity, Three-Dime nsional (3-D) memory module has been developed. NEC has developed a ne w type of 3-D memory module which uses single memory module stacking t echnology. It satisfies the demands for higher packaging density using simple structure. The reliability of the single memory modules and 3- D memory module using 16 Mb DRAM (Dynamic Random Access Memory) was te sted. The results suggest that our 3-D memory modules have good reliab ility. With our DIMM (Dual Inline Memory Module), no breaks in the sol der bonds between single memory modules and motherboards were observed over 3,000 cycles of T/C.