PACKAGE TECHNOLOGY FOR CELLULAR PHONES

NEC has developed an MCM (Multichip Module) using the CIB (Chip in Boa rd) method. This MCM is designed for use in the control module of a ne w digital cellular phone ''JUWACKY dagger.'' The design of the MCM ado pts a Three-Dimensional (3-D) packaging structure in which a bare IC ( Integrated Circuit) chip is mounted inside a PWB (Printed Wiring Board ) and SMDs (Surface Mount Devices) such as the QFP (Quad Flat Package) are mounted on both sides of it. With this module, much greater minia turization has been realized.