THERMOELECTROELASTIC GREENS-FUNCTION AND ITS APPLICATION FOR BIMATERIAL OF PIEZOELECTRIC MATERIALS

Authors
Citation
Qh. Qin et Yw. Mai, THERMOELECTROELASTIC GREENS-FUNCTION AND ITS APPLICATION FOR BIMATERIAL OF PIEZOELECTRIC MATERIALS, Archive of applied mechanics, 68(6), 1998, pp. 433-444
Citations number
17
Categorie Soggetti
Mechanics
ISSN journal
09391533
Volume
68
Issue
6
Year of publication
1998
Pages
433 - 444
Database
ISI
SICI code
0939-1533(1998)68:6<433:TGAIAF>2.0.ZU;2-G
Abstract
For a two-dimensional piezoelectric plate, the thermoelectroelastic Gr een's functions for bimaterials subjected to a temperature discontinui ty are presented by way of Stroh formalism. The study shows that the t hermoelectroelastic Green's functions for bimaterials are composed of a particular solution and a corrective solution. All the solutions hav e their singularities, located at the point applied by the dislocation , as well as some image singularities, located at both the lower and t he upper half-plane. Using the proposed thermoelectroelastic Green's f unctions, the problem of a crack of arbitrary orientation near a bimat erial interface between dissimilar thermopiezoelectric material is ana lysed, and a system of singular integral equations for the unknown tem perature discontinuity, defined on the crack faces, is obtained. The s tress and electric displacement (SED) intensity factors and strain ene rgy density factor can be, then, evaluated by a numerical solution at the singular integral equations. As a consequence, the direction of cr ack growth can be estimated by way of strain energy density theory. Nu merical results for the fracture angle are obtained to illustrate the application of the proposed formulation.