M. Kamon et al., AUTOMATIC-GENERATION OF ACCURATE CIRCUIT MODELS OF 3-D INTERCONNECT, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(3), 1998, pp. 225-240
In order to optimize high-speed systems, designers need tools that aut
omatically generate reduced-order SPICE compatible models from geometr
ic descriptions of interconnect and packaging, In this paper, we consi
der structures small compared to a wavelength, and use a discretized i
ntegral formulation combined with an Arnoldi-based model-order reducti
on strategy to compute efficiently accurate reduced-order models from
three-dimensional (3-D) structures. Several issues are addressed inclu
ding: 1) formulation to insure passivity in the reduced-order models;
2) efficient reduction using preconditioned inner-loop iterative metho
ds; 3) expansion about multiple s-domain points, Results are presented
on several industrial examples to demonstrate the capabilities and sp
eed of these new methods.