Om. Ramahi et al., DYNAMIC ANALYSIS OF V-TRANSMISSION-LINES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(3), 1998, pp. 250-257
In this work, a dynamic analysis of the V line is presented. Previous
work analyzed the performance of this structure for low frequency appl
ications using quasistatic approximations. Here, we extend the analysi
s of the V line into the higher frequency range where dispersion becom
es significant and where it cannot be predicted by quasistatic methods
. We show that the V line provides features and advantages that are no
t present in the conventional microstrip structures, most notably the
appreciable decrease in coupling between adjacent lines in comparison
with the conventional microstrip structure, This feature makes the V l
ine well suited for high packaging density applications. The full-wave
analysis is carried out using a Yee-cell based finite-difference time
-domain (FDTD) method, while enforcing a highly efficient and stable m
esh truncation technique. Results are presented for a single and multi
conductor structures.